多層プリント基板のレーザ加工穴と回路接続の信頼性に関する考察 : 回路銅メッキ内の熱応力に着目した評価手法(機械要素,潤滑,工作,生産管理など)

概要

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This study deals with the characteristics of blind via holes drilled using a laser beam on the multi-layer printed wiring boards. In the present report, the thermal stresses in the copper plating of blind via holes were analyzed by the finite elemental method (FEM) in order to estimate the reliability for the circuit connection between layers. Additionally, the thermal cycle tests of those PWBs were done to research the reliability for the circuit connection formed on blind via holes with various taper hole walls. Comparing the calculated results with experimental ones, it was confirmed that the prediction of the reliability for the circuit connection was possible by the thermal stresses calculated using FEM.
一般社団法人日本機械学会の論文
2001-12-25