AFRP多層プリント基板の回路接続用小径穴の加工特性 : ケプラー繊維およびテクノーラ繊維強化基板の比較

概要

論文の詳細を見る
In the current manufacture of multi-layer printed wiring boards, the method frequently used to laminate the core with insulating resin as build-up layer. However, a problem has emerged in that the strength of the substrate decreases due to the insulating resin part as the multi-layers are progressively formed. Thus, it becomes necessary to use FRP for the insulation layer part. Especially among various kinds of FRPs, AFRP has been considered a suitable FRP because of its low coefficient of linear thermal expansion in the x-y plane. On the other hand, there are various kinds of aramid fibers used to reinforce the plastics. Kevlar fiber and Thecnora fiber are well known among them. Therefore, this paper describes the small diameter drilling in the printed wiring board made of Kevlar fiber reinforced plastics and Thecnora fiber reinforced ones. Especially this report dealt with the blind via holes formed by CO_2 laser and the through hole drilled by a conventional drill tools. The machinability of two types AFRP was compared in small diameter drilling for circuit connection.
一般社団法人日本機械学会の論文
2002-02-25