超高速スピンドルを用いたプリント基板における極小径ドリル加工穴の熱損傷と最適加工条件の考察(機械要素,潤滑,工作,生産管理など)

概要

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Recently, electronic equipments are rapidly widespread. They have been miniaturizing and become multifunctional equipments by the development of IT. Therefore, drilling smaller diameter through holes is needed to manufacture the high density printed wiring boards. On the other hand, a new drilling technology has been attracted attention to use the super-high-speed spindle and the micro diameter drills (less than 0.2 mm). In these drilling conditions, B-RING damage extends more than internal damage around the drilled holes. Then, we investigated the best processing condition of the control of B-RING, considering productivity. Following conclusions were obtained. (1) The temperature of drill tool is raised by decreasing the heat capacity of the drill. B-RING damage around the drilled hole is especially generated under drilling conditions using the super-high speed spindle and the micro diameter drill. (2) B-RING is mainly caused by the heat conducts to the whole wall of the PWB. (3) To raise the R point height is effective method to prevent the B-RING. (4) We confirm to obtain the best drilling condition by considering B-RING and productivity.
社団法人日本機械学会の論文
2008-07-25