ビルドアップ工法によるAFRP多層プリント基板の小径止まり穴特性:小出力レーザによる加工穴の品質

概要

論文の詳細を見る
In the printed wiring board manufacturing sector, methods are developed to improve the circuit packaging density. The multi-layer printed wiring board manufacturing process is receiving particular attension. In the current manufacture of these boards, the method frequently used is to laminate the core with insulating resin. Photo-etching is generally used to form the holes connecting the circuits of these boards. However, a problem has emerged in that the strength of the substrate decreases due to the insulating resin part as the multi-layers are progressively formed. Thus, it becomes necessary to use FRP for the insulation layer part. Since it is very difficult to etch composites, lasers have been proposed for a new way to drill holes in such materials. By appropriate adjustment of the laser panetration energy, the holes are drilled only in the insulation part, and a technique is proposed to stop the holes using the copper foil forming the circuit. AFRP has been considered a suitable FRP for such laser processing. In the present study, attempts were made to experimentally produce multi-layer boards using AFRP and GFRP for the insulation layer, and the characteristics of blind via holes drilling with a small power laser were investigated.
一般社団法人日本機械学会の論文
2000-12-25