レーザ加工による多層プリント基板のブラインドバイアホールの特性 : アラミド繊維とガラス繊維強化基板の比較(<特集>複合材料)

概要

論文の詳細を見る
In recent years, it has been required for the packaging density of PWB to be improved. It is necessary that the holes are made smaller in drilling and that the circuit patterns are made fine and multi-layer. Therefore, laser drilling is paid attention as a new method of the smaller diameter drilling in PWB. This study describes the characteristics of the blind via hole for multi-layers PWB by laser drilling using CO_2 laser beam. Specially, aramid fiber reinforced plastics(AFRP)for laser drilling is compared with glass fiber reinforced plastics(GFRP). As results, it is clear that irradiation time has influence on the damage width around the hole for both PWBs. It takes shorter time to drill the blind via holes on PWB for AFRP than GFRP. Additionally, the taper angle of laser drilled hole is an important factor of copper plating of blind via hole after drilling.
社団法人日本材料学会の論文
1999-05-15