201 冷凍チャックの把持による硬脆材料の切断加工(GS-13 加工(1))

概要

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It has been mainly used that wax and adhedive to chuck thin workpieces, such as brittle materials utilized electronic components. These methods have some defects, and for instance, cause chipping in their processing and are needed to clean after these process. One the other hand, vacuum chuck and magnetic chuck are also representative methods. However, it has some problems, such as causing the crack due to adsorption and so on. Therefore, freezing chuck is paid attention. Its mechanism is that workpiece is held on the freezing medium which is frozen. Owing to method, it is possible to chuck workpieces which are non-magnetic materials, complexity shaped materials and so on without using any adhesives. In addition, It is considered that it controls the occurence of chipping and omits cleaning process. From this study, it became clear that freezing chuck method is better than wax method at the time of cutting silicon wafer.
社団法人日本機械学会の論文
2004-03-17