単結晶ダイヤモンドドリルを用いた単結晶シリコンの高品位穴加工

概要

論文の詳細を見る
Monocrystalline silicon is the most important material for semiconductor industry, and is also widely used as a component material of the semiconductor manufacturing equipment which needs the precision machining. However the high performance machining technology without micro cracks for brittle materials has not yet been established. Especially the high aspect ratio drilling less than 1mm in diameter is very difficult. Therefore, the new drilling method of monocrystalline silicon was introduced in this paper. The experimental analysis made it clear that the mirror finished surface without micro cracks was obtained by using the monocrystalline diamond drill, while many micro cracks were generated in the case of sintered diamond drill. Furthermore, the removal rate and the tool life were enough for high performance drilling.
社団法人精密工学会の論文
2006-02-05