Development of Micro Channel Heat Exchanging
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概要
- 論文の詳細を見る
In order to investigate the performance of the micro channel heat exchanger, three-dimensional numerical simulations and experiments on heat transfer behavior and pressure loss were carried out. So far as the heat transfer phenomena is concerned, results obtained using a silicon chip micro channel model showed a very small thermal resistance, about 0.1(K(cm)^2/W). And, measured pressure loss showed good agreement with that of analytical result obtained on the basis of fully developed laminar pipe flow assumption. Furthermore, a practical setup was made with a micro channel heat exchanger to clarify the possibility of using the micro channel heat exchanger in electrical equipment. As a result, it was confirmed that the performance of the micro channel heat exchanger system is sufficient to cool a silicon chip which generates a large amount of heat, and the scale of the system is compact compared to that of the whole setup of electrical equipment.
- 一般社団法人日本機械学会の論文
- 2001-11-15
著者
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Iwasaki Hideo
Mechanical Systems Laboratory Toshiba Corporation
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Ishizuka Masaru
Department Of Mechanical System Engineering Toyama Prefectural University
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KAWANO Koichiro
Mechanical System Laboratory R. D. Center Toshiba Corp.
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SEKIMURA Masayuki
Mechanical Systems Laboratory, R & D Center, Toshiba Corp.
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MINAKAMI Ko
Mechanical Systems Laboratory, R & D Center, Toshiba Corp.
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ISHIZUKA Masaru
Faculty of Engineering, Toyama Prefectural University
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Minakami Ko
Mechanical Systems Laboratory R & D Center Toshiba Corp.
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Sekimura Masayuki
Mechanical Systems Laboratory R & D Center Toshiba Corp.
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Iwasaki Hideo
Mechanical System Laboratory R. D. Center Toshiba Corp.
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