Cu-Ti合金によるSiC/SiC接合体の組織と強度 : 活性金属ろうによるシリコン系セラミックスの接合の研究(第2報)

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SiC was brazed to SiC with Cu-Ti alloys containing Ti content up to 50 at% at 1373 K for 1.8 ks in vacuum, where pressureless sintered SiC were used. The strength of SiC/SiC joints were measured by 4-point bending test at room temperature and elevated temperature. The microstructures and elemental distribution and reaction phases in the joining layers were investigated by means of electron probe micro-analyser and X-ray diffract-meter. The main results obtained are summarized as follows.(1) The strength of SiC/SiC joint increases with increasing Ti content in Cu-Ti alloys for Ti content up to 34 at%, and shows the maximum of 208 MPa at Ti content of 34 at%.(2) Ti in the alloys with Ti content up to 15 at% reacts with SiC and forms TiC, Ti_5Si_3 and TiSi. Ti in the alloys with Ti content from 20 at% to 25 at% reacts with SiC and forms TiC, Ti_3SiC_2,Ti_5Si_3 and TiSi. Ti in the alloys with Ti content of 34 at% or more reacts with SiC and forms TiC, Ti_3SiC_2,TiSi and TiSi_2.(3) The formation of TiC and Ti_5Si_3 at the interface between SiC and Cu-Ti alloy prevents the direct reaction of copper with SiC, and reduces the thickness of the brittle copper penetrating layer. The formation of thick carbide layer of Ti_3SiC_2 is attributable to the maximum strength of SiC/SiC joint.(4) The SiC/SiC joint brazed with Cu-34 at% Ti alloy represents the strength of 208 MPa up to testing temperature of 723 K, and the degration of strength with further increasing the temperature.
1996-05-05

Cu-Ti合金によるSiC/SiC接合体の組織と強度 : 活性金属ろうによるシリコン系セラミックスの接合の研究(第2報)

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