Transient Liquid Phase (T.L.P.) Diffusion Bonding of Nickel-Base Heat Resisting Alloys
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概要
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This study was carried out to make clear the bonding mechanism of the transient liquid phase diffusion bonding. From the experimental results, it is concluded that both isothermal solidification process and mutual diffusion process have an important role in the bonding mechanism of the transient liquid phase diffusion bonding.
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著者
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Ikawa Hiroshi
Faculty Of Engineering Osaka University
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NAKAO Yoshikuni
Faculty of Engineering, Osaka University
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Nakao Yoshikuni
Faculty Of Engineering Osaka Univ.
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IKAWA Hiroshi
Faculty of Engineering, Osaka University
関連論文
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- Austenite Grain Growth of Steel in Weld-Heat Affected Zone
- Study on Hot Cracks in Cast Ni-Base Superalloy, B-1900
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- Theoretical Considerations on the Metallurgical Process in T.L.P. Bonding of Nickel-Base Superalloys
- Study on Weldability of Dispersion Hardening Alloy
- Transient Liquid Phase (T.L.P.) Diffusion Bonding of Nickel-Base Heat Resisting Alloys
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- Effect of Rapid Solidification on Corrosion Resistance of Stainless Steels : Study on Surface Modification of Stainless Steels by Laser Surface Melting (Report 6)
- Effect of Rapid Solidification on the Delta-ferrite Content in Microstructure and Its Implications on the Schaeffler diagram : Study on Surface Modification of Stainless Steels by Laser Surface Melting (Report 5)
- Effect of Rapid Solidification on the Microstructures and Delta-ferrite Morphologies : Study on Surface Modification of Stainless Steels by Laser Surface Melting (Report 4)
- Study on Reheat Cracking of Ni-base Superally, Waspaloy
- Desensitization of Stainless Steels by Laser Surface Heat-Treatment