Theoretical Considerations on the Metallurgical Process in T.L.P. Bonding of Nickel-Base Superalloys
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概要
- 論文の詳細を見る
T.L.P. (Transient Liquid Phase) bonding is one of the most desirable methods to join hot cracking susceptible alloys such as Ni-base superalloys. In this study, the metallurgical process in T.L.P. bonding was considered theoretically to clarify the bonding mechanism and obtain bonding conditions to ensure joint performance. The solidification process of liquid film at bonding region was theoretically found to be controlled by the diffusion process of depressant element in the matrix. It was also made clear that during homogenizing heat treatment after bonding, mutual diffusion of alloy elements occurred and homogenizing conditions were given by eq. (9).
- 社団法人溶接学会の論文
- 1979-04-01
著者
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NAKAO Yoshikuni
Faculty of Engineering, Osaka University
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IKAWA Hiroshi
The Osaka Institute of Technology
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ISAI Toshinori
Press Kogyo Co., Ltd
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Nakao Yoshikuni
Faculty Of Engineering Osaka Univ.
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Isai Toshinori
Press Kogyo Co. Ltd
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