機能性磁性薄膜作製技術の現状と展望(<特集>「磁性薄膜作製技術」)

概要

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Fundamental technological key items for magnetic thin film fabrication currently used are widely reviewed in connection with the sputtering process. Ultra clean process (UC-process) and its fundamental concept based on high vacuum technology are introduced. Various remarkable effects on the magnetic properties by applying UC-process are presented in connection with the unique change of the film microstructure in CoCr based alloys for the sputtered longitudinal and perpendicular disk media. The role of the low electron temperature plasma (T_e), especially by using radial line slot antenna (RLSA) with μ-wave, is presented. Insulating barrier layer formation of Al_2O_3 and AlN for TMR junction, and the phase formation of α''-Fe_<16>N_2 are discussed in connection with the existence of the reactive species produced under low T_e plasma. Further discussion is developed for interlayer roughness and grain diameter in metallic multilayers. Remarkable effect on GMR properties and the seed materials to control the initial film growth are presented in connection with the degree of cleanness of the sputtering atmosphere.
社団法人日本磁気学会の論文
2005-09-01