Sub-μmオーダの押し込み試験による脆性材料の変形挙動の観察 : 脆性材料の延性型切り屑生成のための基礎研究

概要

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The background of this study lies in the investigation of the formation mechnism of ductile mode (nanometer-size) chips of brittle materials such as fine ceramics, glass and silicon. As the first step to achieving this purpose, this paper intends to observe the micro-deformation behavior of these materials in sub-μm depth indentation tests using a diamond indenter. As a result, some characteristics were experimentally observed on indentation curves plotted continuously against loading/unloading cycle, as well as various effects dominating them, such as creep, resporation, crack and residual stress. Moreover, from the characteristic curves obtained in the sub-μm indentation tests, possibility of evaluating the mechanical properties (including yield effect) of brittle materials under the sub-μm interference using an indenter was confirmed.
1994-01-25