基板加工振式プラズマエッチングの研究(第2報) : 加振性能の向上によるエッチングレートの改善

概要

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Mechanical vibration plasma etching system has been improved by an enforced vibration mechanism. In the new system, two types of vibrators have developed for higher frequency and larger specific energy than the previous system. They have resonant frequencies of 28kHz and 40kHz, and vibration is amplified by step horns resulting in amplitudes of 12μm and 5μm, respectively. Etching experiments are performed by using silicon chips with Si0_2 masks. A maximum etching rate improvement of 780% is obtained in an SF_6+O_2 gas mixture with a vibration frequency of 40kHz, however, anisotropy is not so improved as expected by the vibration. This paper describes expecting effects, construction of the vibration mechanism and experimental results, which indicates usefulness of the new system.
公益社団法人精密工学会の論文
2001-10-05