ダイヤモンド電着エンドレスワイヤ工具の試作 : 試作法と接合部評価

概要

論文の詳細を見る
At present, slicing for electronic materials are taken methods such as ID-blade, OD-blade, Multiwire sawing and so on. The electronic materials, e. g. silicon ingot, become large size year by year, and development of the slicing method to decrease kerf loss and to obtain high quality surface are required. Therefore, an electrodeposited wire tool of diamond grains is paid attention to one of the slicing tools. This method is high efficient slicing compared with slicing method used abrasive grains and is clean around the work stage. In the slicing method used an electrodeposited endless wire tool of diamond grains developed though this research, the mechanism of slicing apparatus becomes very simple and high speed slicing can be expected. In this study, the electrodeposited wire tool of diamond grains is made in Watt bath of nickel plating, and both ends of the electrodeposited wire is welded by YAG laser. This report describes best welding conditions and tensile stress at the welding point of the electrodeposited wire tool.
公益社団法人精密工学会の論文
1993-06-05