ダブプリズムを用いた接触画像解析に基づくポリシングパッド表面性状の定量評価手法の開発に関する研究 : —ドレッサ粒度がパッド表面性状に及ぼす影響—

概要

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Polishing is generally used in fabricating high-quality silicon wafers. Polishing efficiency and accuracy depend not only on the pad surface texture but also the actual conditions of contact between the wafer and the pad. Furthermore, the pad surface texture is affected by the dressing conditions. Currently, no effective quantitative methods or parameters for pad surface evaluation have been established. In this study, we propose a technique based on contact image analysis using an image rotation prism. We also discuss the effect of dressing conditions on the following parameters : (1) contact ratio, (2) number of contact points, (3) spacing of contact points and (4) spatial FFT results of a contact image. These parameters were found to be effective for evaluating pad surface texture.
公益社団法人精密工学会の論文