遺伝的アルゴリズムを用いた4way方式定盤における半径方向溝割合の最適化

概要

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In the lapping/polishing is used frequently for making high precision surface finishes, and the waviness reduction in lapped/polished wafers needs to be improved. It is known that the efficiency depends on the relative friction distance between the lapping plate/polishing cloth and the wafer, and that the wafer waviness depends on the result of the deviation of relative friction distance. This study presents a method for making optimal lapping plate/polishing cloth groove rates in the radius direction for the 4-way wafer system. A genetic algorithm is used for decreasing the deviation of relative friction distance at wafer surface. The maximum deviation of relative friction distance under each calculation conditions is used for optimizing fitting function at the genetic algorithm in this paper. Simulation results show the genetic algorithm can design groove rates in a lapping plate/polishing cloth in which the deviation of relative friction distance to be remarkably small.
公益社団法人精密工学会の論文
2004-05-05