Microstructural Fabrication for Measuring Residual Strains of CMOS Thin Films

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概要

• 論文の詳細を見る
• 1999-06-30

著者

• CHANG Pei-Zen

  Institute of Applied Mechanics, National Taiwan University

• Chang Pei-zen

  Institute Of Applied Mechanics National Taiwan University

• DAI Ching-Liang

  Department of Mechanical Engineering, National Chung Hsing University

• Dai Ching-liang

  Department Of Mechanical Engineering Oriental Institute Of Technology

関連論文

• In Situ Monitoring of Silicon Membrane Thickness during Wet Etching using a Surface Acoustic Wave Sensor
• Complementary Metal-Oxide-Semiconductor Microelectromechanical Pressure Sensor Integrated with Circuits on Chip
• System Perspective of Electromechanical Devices Development of the NEMS/MEMS Group at National Taiwan University(Recent Development of Electro-Mechanical Devices (IS-EMD 2002))
• Invited paper System Perspective of Electromechanical Devices Development (国際セッションIS-EMD2002〔英文〕)
• System Perspective of Electromechanical Devices Development of the NEMS/MEMS Group at National Taiwan University
• Microstructural Fabrication for Measuring Residual Strains of CMOS Thin Films
• Complementary Metal–Oxide–Semiconductor Microelectromechanical Pressure Sensor Integrated with Circuits on Chip
• Fabrication of a Micromachined Tunable Capacitor Using the Complementary Metal–Oxide–Semiconductor Post-Process of Etching Metal Layers
• A Micromachined Microwave Switch Fabricated by the Complementary Metal Oxide Semiconductor Post-Process of Etching Silicon Dioxide
• In Situ Monitoring of Silicon Membrane Thickness during Wet Etching using a Surface Acoustic Wave Sensor
• Novel Method for In Situ Monitoring of Thickness of Quartz during Wet Etching
• Fabrication of Integrated Chip with Microinductors and Micro-Tunable Capacitors by Complementary Metal–Oxide–Semiconductor Postprocess

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