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Semiconductor Div. Electronics And Telecommunications Research Institute | 論文
- Implementation of 155.52Mbps Physical Layer Processor for ATM Applications
- Implementation of 155.52Mbps Physical Layer Processor for ATM Applications
- A 3.3 V 0.8 μm CMOS IF IC for CDMA/FM Cellular Phone
- A 3.3 V 0.8 μm CMOS IF IC for CDMA/FM Cellular Phone
- Stress Behavior of High Density Plasma Chemical Vapor Deposition Oxide Deposited on a Metal-Patterned Wafer
- An Implementation of 16-bit Syndrome Calculators
- Recovery of Silicon Surface after Reactive Ion Etching of SiO_2 using CHF_3/C_2F_6 Plasma
- Fabrication and Characterization of Silicon Field Emission Cathodes using Spin-on-Glass Etch-back Process
- Fabrication and Characterization of Silicon Field Emission Cathodes using Spin-on-Glass Etch-back Process
- Implementation of Modem ASIC for CDMA/FM dual-mode Cellular Mobile Phone
- Implementation of Modem ASIC for CDMA/FM dual-mode Cellular Mobile Phone
- Low Noise Characteristics of 0.2μm Al_Ga_As/In_Ga_As/GaAs Pseudomorphic HEMTs with Wide Head T-Shaped Multifinger Gate
- Highly Reflective 1.55 μm In_Ga_xAl_yAs/In_Al_zAs Quaternary Bragg Mirrors Grown by Metalorganic Chennical Vapor Deposition (MOCVD)
- An Implementation of 16-bit Syndrome Calculators