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Integrated Research Institute, Tokyo Institute of Technology | 論文
- On-Chip Thermal Gradient Analysis Considering Interdependence between Leakage Power and Temperature(Simulation and Verification,VLSI Design and CAD Algorithms)
- Extraction of Cd^ and Am^ Ions into Organic and Fluorous Solvents with a TPEN Chelating Agent bearing a Fluoroalkyl Substituent
- Thermal-Swing Extraction Separation of Am (III) and Eu (III) with Poly-NIPA Gel Crosslinked with TPEN Derivative
- Thermal-swing Extraction of Cadmium(II) by Thermosensitive Polymer Gel Crosslinked with Encapsulating Hexadentate Ligand
- Low-Loss Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology(Microwaves, Millimeter-Waves)
- On-Chip Yagi Antenna for Wireless Signal Transmission in Stacked MCP
- Zero-Crosstalk Bus Line Structure for Global Interconnects in Si Ultra Large Scale Integration
- RF Passive Components Using Metal Line on Si CMOS(Analog Circuit and Device Technologies)
- Zero-Crosstalk Bus Line Structure for Global Interconnects in Si ULSI
- High-Speed Transmission Circuit for Micro Network on Si ULSI
- Twisted Differential Transmission Line Structure for EMI Noise Reduction at Global Interconnect in Si LSI
- Statistical Modeling of a Via Distribution for Yield Estimation(Interconnect,VLSI Design and CAD Algorithms)
- Wire Length Distribution Model for System LSI(Interconnect, VLSI Design and CAD Algorithms)
- Evaluation of X Architecture Using Interconnect Length Distribution(Interconnect, VLSI Design and CAD Algorithms)
- in-vivo Wireless Communication System for Bio MEMS Sensors
- Equivalent Circuit Model for On-Chip Variable Inductor
- A Novel Method for Improving Overload Capability of Stand-alone Power System Based on a Flywheel Induction Motor
- Design of On-Chip High Speed Interconnect on Complementary Metal Oxide Semiconductor 180 nm Technology
- Linear Time Calculation of On-Chip Power Distribution Network Capacitance Considering State-Dependence
- Temperature-Dependent Change of Extraction Performance of Soft Cadmium(II) Ion with TPEN-NIPA Gel. Studies on the Effect of the Ethylenediamine Skeleton