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Hitachi High-Technologies Corp. | 論文
- Development of an Enterprise-Wide Yield Management System Using Critical Area Analysis for High-Product-Mix Semiconductor Manufacturing
- A method for multidirectional TEM observation of a specific site at atomic resolution
- Development of dedicated STEM with high stability
- Impact of Long-Period Line-Edge Roughness (LER) on Accuracy in Critical Dimension (CD) Measurement and New Guideline for CD Metrology
- Evaluation of TEM samples of an Mg-Al alloy prepared using FIB milling at the operating voltages of 10kV and 40kV
- Characterization of Line-edge Roughness in Cu/low-k Interconnect Pattern
- Application of a FIB-STEM system for 3D observation of a resin-embedded yeast cell
- Estimation of Radiation Damage and Pattern Resolution in Ion Direct Writing Using Scattering of Low Energetic Ions
- Characterization of Line-Edge Roughness in Cu/Low-$k$ Interconnect Pattern
- The development and characteristics of a high-speed EELS mapping system for a dedicated STEM
- Development of a real-time jump-ratio imaging system equipped with a STEM
- Study of Measurement Condition Optimization in Critical Dimension-Scanning Electron Microscope
- Impact of Long-Period Line-Edge Roughness (LER) on Accuracy in Critical Dimension (CD) Measurement and New Guideline for CD Metrology
- A Detection Method for a T-Topped Profile in Resist Patterns by Top-Down-View Critical Dimension Scanning Electron Microscope