スポンサーリンク
Department of Manufacturing Science, Graduate School of Engineering, Osaka University | 論文
- Reactivity between Sn-Ag Solder and Au/Ni-Co Plating to Form Intermetallic Phases
- Laser Cladding of Fe-Cr-C Alloys on A5052 Aluminum Alloy Using Diode Laser
- Tensile Strength and Pseudo-elasticity of YAG Laser Spot Melted Ti-Ni Shape Memory Alloy Wires
- BCD-08 DYNAMIC ANALYSIS OF TIMING CHAIN LOAD FOR AUTOMOTIVE ENGINES(BELT AND CHAIN DRIVES)
- New Process of Self-Organized Interconnection in Packaging Using Conductive Adhesive with Low Melting Point Filler
- Formation of a Self-Interconnected Joint using a Low-Melting-Point Alloy Adhesive
- The Effect of Reduction Capability of Resin Material on the Solder Wettability for Electrically Conductive Adhesives (ECAs) Assembly
- Microstructure and Tensile Strength of Stainless Steel Wires Micro Spot Melted by YAG Laser
- Investigation of the Dynamic Reactive Wetting of Sn-Ag-Cu Solder Alloys on Ni(P)/Au Coated Cu Substrates
- Properties of Solder Joints Using Sn-Ag-Bi-In Solder
- Trial-Less Machining Using Virtual Machining Simulator for Ball End Mill Operation(Advanced Manufacturing Technology [I])
- Effect of Cu in Pb Free Solder Ball on the Microstructure of BGA Joints with Au/Ni Coated Cu Pads
- Electron-Impact Double Ionization of Ba^+
- Water Motion in a Water Curtain Head for Cleaning a Large Glass Plate
- Automatic Production Planning System to Achieve Flexible Direct Machining(Advanced Manufacturing Technology)
- Highly Precise Positioning Method by Pull-Up Model Self-Alignment Process Using Liquid Surface Tension
- Influence of the Interfacial Reaction Layer on Reliability of CSP Joints Using Sn-8Zn-3Bi Solder and Ni/Au Plating
- 5C2 STUDY FOR SYSTEM ARCHITECTURE IN PROJECT BASED PRODUCTION
- Parametric Design for Resin Self-Alignment Capability(Electronic Components)
- Melting and Joining Behavior of Sn/Ag and Sn-Ag/Sn-Bi Plating on Cu Core Ball