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Department Of Applied Chemistry School Of Advanced Science And Engineering Faculty Of Science And En | 論文
- Expansion Working of Brass Tubes by Plug Drawing
- The Mechanism of Correcting the Eccentricity of Brass Tubes by Sinking
- P-493 Studies on Constituents of Erythrina variegata (Leguminosae)
- A new amide from the leaves and twigs of Litsea auriculata
- Phytochemical Flavones with the Antibacterial Activity against Methicillin-Resistant Staphylococcus aureus
- Thermostable ATP Regeneration System Using Polyphosphate Kinase from Thermosynechococcus elongatus BP-1 for D-Amino Acid Dipeptide Synthesis(BIOCHEMICAL ENGINEERING)
- Substrate Specificity of Thermostable D-Alanine-D-alanine ligase from Thermotoga maritima ATCC 43589
- D-Amino Acid Dipeptide Production Utilizing D-Alanine-D-Alanine Ligases with Novel Substrate Specificity(Enzymology, Protein Engineering, and Enzyme Technology)
- Evaluation of [111]-Textured Cu Layer Formed on Thin Nb Barrier Layer on SiO_2(Session 8A Silicon Devices V,AWAD2006)
- Evaluation of [111]-Textured Cu Layer Formed on Thin Nb Barrier Layer on SiO_2(Session 8A Silicon Devices V)
- A New Method of Synthesis of Alkyl β-Glycosides Using Sucrose as Sugar Donor
- Simultaneous determination of catechins in human saliva by high-performance liquid chromatography
- Structure-Based Modification of D-Alanine-D-Alanine Ligase from Thermotoga maritima ATCC 43589 for Depsipeptide Synthesis
- Cross-Sectional Observation of Fe_3O_Fe_2O_3 Intermediate Thin Films
- Study on Tube-Expanding by Drawing of Phosphor Deoxidized Copper Tubes : Fourth Report : Relations between Contact Length and Dimensional Accuracy
- Study on Tube-Expanding by Drawing of Phosphor-Deoxidized Copper Tubes : Third Report : Relations between Tool Shapes and Changes in Wall-thickness
- Barrier Properties of Thin ZrNx Films Prepared by Radical-Assisted Surface Reaction
- Atomic Layer Deposition of Thin VNx Film from Tetrakis(diethylamido)vanadium Precursor
- Study on Precision Clad Tube Working by Tube-Expanding
- Application of Extremely Thin ZrN Film as Diffusion Barrier between Cu and SiOC