スポンサーリンク
社団法人 エレクトロニクス実装学会 | 論文
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- Study of Chemical Structure and Dielectric Loss Tangent of Flame Retardants
- Fatigue Life Evaluation of Al-Base BGA Solder Ball Joints.
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- Film Properties of Full-additive Electroless Copper Deposits and their Electrochemical Mixed Potential Monitoring
- Recent Trend of High Functionality High Performance Materials—Preface
- Nonlinear Behavior Study on Effect of Hardening Rule of Lead Free Solder Joint
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- Electrochemical Mechanism on Improvement of Wettability by Addition of Lead to Sn-3.4Ag Lead-Free Solder.
- Low CTE & High Elastic Modulus Substrate for Semiconductor Packaging.
- Board-Level Optical Interconnections Using a Plastic Optical Fiber Wiring Sheet Equipped with Right-Angle-Turn Connectors.
- UV curable through-hole plugging system.
- Improvement of Adhesion for Layer to Layer Connection for Build-up Printed Circuit Boards.
- Reliability Evaluation of Solder Joints in Ball-Grid-Array-Type Packages by Impact Bending Test
- Lithium Ion Batteries.
- Evaluation of Mechanical Properties of Pb Free Solder Alloys.
- Rupture Life of CSP Solder Joints with Sn-Ag Lead-Free Solders under Thermal Cycle Condition.
- Chip Scale Package.
- Ultrasonic Bonding of Resin-Coated Cu Wire for High-Frequency Chip Coils
- Effect of Cu Cored Ball in Solder Ball on Microstructure and Strength of BGA Joint.