Film Properties of Full-additive Electroless Copper Deposits and their Electrochemical Mixed Potential Monitoring

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The relationship between mixed potential and crystal states was confirmed from a TEM observation of deposits and a measurement of electrochemical mixed potential for varing additives of a full-additive electroless copper plating bath. The plating conditions of longer transition time and less cathodic mixed potential made the crystal particle of deposits larger, however in the case of shorter transition time and more cathodic mixed potential, the size of crystals became fine and the particle density of deposits increased, respectively.<BR>The measurement of mixed potential and the TEM observation of deposits during long term electroless plating was performed and disscussed on the basis of the relationship between mixed potential and crystal states obtained from the above experiments. The relationship between variation of mixed potential and TEM results for long term bath performance was corresponding well to the above results of additive effect. Furthermore, the mixed potential measurement for long bath operation was indicated to become the monitoring sensor for long term bath control system.
社団法人エレクトロニクス実装学会の論文