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社団法人 エレクトロニクス実装学会 | 論文
- Space Charge Behaviour and Internal Electric Field Distribution of Printed Circuit Board Insulations
- Special Articles: Recent Trends on MCM and Bare LSI Chip Mounting. Recent Electronic Equipment Using MCM and Bare Chip Mounting. The Application of MCM to Personal Computer Circuit Assembly.
- Design Concept of the Latest System Packaging. Electronic Equipment for Automobile Applications.
- The Breaking Process of Film Conductor in Printed Circuit by Impulse Current
- EMC Design CAD Systems for Printed Circuit Boards
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- Environmentally Conscious Engineering in Electronics. 1. A Bonding Method Which is Designed for Separating at the Interface: Reversible Interconnection.
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- Comparison of BGA Jointing Property of Sn-Ag and Sn-Ag-Cu Solder Balls on EN/IG Finished Boards.
- Present and Future of Build-up PWB's-Their Possibility and Limitation. Design Method of Build-up PCB, Noise, Thermal and Impedance Matching Including Simulation.
- Atmospheric Self-Aligned Assembly of Optical Chips for Hybrid-Integrated SOAG Array Modules Using Liquid-Assisted Re-Flow Technique.
- Mechanical Properties and Microstructure of Sn-Ag-Cu-Ni-Ge Lead Free Solder
- Laser trimming technology.
- Optical Circuit Packaging Technology. 90-Degree Optical Path Conversion Technology in Optical Circuit Packaging.
- First Pan Pacific Microelctronics Symposium
- Intention to Special Edition
- Large PDP Fabrication Process and Glass Substrates.
- A New Encapsulationg Method Using Thin Resin Sheets.
- Intention to the Special Edition