Environmentally Conscious Engineering in Electronics. 1. A Bonding Method Which is Designed for Separating at the Interface: Reversible Interconnection.

概要

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A novel approach to reversible interconnection has been proposed to carry on recycle of materials smoothly for the protection of the environment. The new means of reversible interconnection is defined as a bonding method which is designed for separating at the interface. In this proposition, "direct bonding" is realized by"the surface activated bonding (SAB) method at room temperature" and"separation" by"control of reactions at the interface". The concept of the reversible interconnection is demonstrated for the case of Al-austenitic stainless steel system. Al and stainless steel has been jointed successfully by SAB method at room temperature. The interface obtained a high bond strength value. By heating the joint at 823K in a vacuum atmosphere, a brittle layer was precipitated at the interface and then the joint can be separated at the interface between Al and the intermediate layer without applying any external mechanical force.
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