The Breaking Process of Film Conductor in Printed Circuit by Impulse Current

概要

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The experimental studies on the breaking process of film conductor in printed circuits are described. The experiment was carried out on the model printed circuit, which has a thickness of 35μm, widths of 0.5 to 5 mm and a length of 10cm. The current and terminal voltage impressed on the film conductor were measured by a dual beam oscilloscope. The breaking section and the structure of the film conductor were observed with a microscope and an X-ray microanalyzer.<BR>By application of the current, the film conductor of the printed circuit was torn off from the plastic-board and the ripple marks were formed on the film conductor. As the applied current was increased, the film conductor was deformed into a string-like form. The breaking current density of the film conductor was about 90 kA/mm<SUP>2</SUP>. At the breaking section of the film conductor, copper crystals of the order of 2-10μm were observed.<BR>These phenomena are explained as follows: the copper crystals grew up as a result of the temperature rise of the film conductor by the application of the current. Formation of the ripples and shrinking of the film conductor into a string-like form were caused by the heating stress. And most of the breaking of the film conductor occurred by the heating stress caused by applied current.
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