Mechanical Properties and Microstructure of Sn-Ag-Cu-Ni-Ge Lead Free Solder

概要

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New lead-free, Sn-Ag-Cu based solder alloys with a small amount of added Ni and Ge, have been developed. While the addition of Ge prevented the oxidation of Sn and improved solder wettability, the addition of Ni aims at the improvement of mechanical properties by stabilizing the precipitate. In this paper, the tensile behavior and the microstructures of these solder alloys were studied. The results show that the size and the interval of the solder alloy particles in the eutectic region of the Sn-3.5Ag-0.5Cu-Ni-Ge solder, which has a Ni content of 0.07wt%, are larger than those of the Sn-Ag-Cu solder without Ni. Moreover, the elongation of the solder increases while the tensile strength is slightly reduced. Furthermore, using the average particle size and the average interval of the particles in the eutectic region, the change of the tensile strengths between the initial state and the state after aging treatment at 125°C for 1000 h can be explained.
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