Low CTE & High Elastic Modulus Substrate for Semiconductor Packaging.

概要

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A low CTE (Coefficient of Thermal Expansion) and high elastic modulus substrate (E-679F) has been developed with applications for the printed wiring boards (PWBs) for semiconductor mounting used in Ball Grid Arrays (BGAs) and Chip Size / Scale Packages (CSPs) . A new interphase control system allows the inorganic element ratio of E-679F to be about two times that of the usual PKG material. Therefore, the elastic modulus increases by 1.4 times, and the CTE is reduced by 30%. Furthermore, the surface of the substrate is very flat, and the surface hardness is increased by greater than 1.7 times. The water absorption of this substrate is low, being about 60% of the conventional package substrates, and also has excellent solder reflow properties. E-679F is effective for those plastic packages which are becoming thinner and having higher density.
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