Reliability Evaluation of Solder Joints in Ball-Grid-Array-Type Packages by Impact Bending Test
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概要
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A method of testing the reliability of solder bump joints by impact bending was developed. The reliability of the solder bump joints can be evaluated from the maximum value of the initial surface strain in a printed wiring board (PWB) during the impact-bending test. It is possible to control the maximum value and the rising time of the surface strain by adjustment of the fixed distance of the PWB specimen, the weight of the falling rod, and the drop height of the rod. The life of the solder bump joints increases with decreasing the surface strain, and this relationship corresponds with the results by the fall impact test.
- 社団法人 エレクトロニクス実装学会の論文