Improvement of Adhesion for Layer to Layer Connection for Build-up Printed Circuit Boards.

概要

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As the conductor density of the printed circuit boards increases with the demand for miniaturization of the electronic devices, the build-up method has been paid attention to achieve the requirement. The build-up method is a new manufacturing process accumulating an insulation layer and a conductive layer sequentially on the core circuit boards. The fundamental technologies such as selection of insulator, formation of via-holes and preparation of fine patterns are required to further improve this process. Among them, the adhesion strength between the copper conductor and insulation layer is significant to improve the connection reliability. This paper describes an improvement of adhesion strength between the copper and insulation layer using the additives in the electroless copper plating bath. Adhesion measurements were conducted using photoimageable resin and unclad resin. The adhesion strength was 1.14kgf/cm for the photoimageable resin and 1.43kgf/cm for the unclad resin with potassium thiocyanate added bath, with which tear fragments of the resin were observed on the detached copper side. On the other hand, the adhesion strength was not improved with additive-free and thiomalic acid added bath.
社団法人エレクトロニクス実装学会の論文