Effect of Cu Cored Ball in Solder Ball on Microstructure and Strength of BGA Joint.
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概要
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Effect of Cu core in BGA solder ball was investigated on the joint shear strength and the microstructural evolution after high temperature storage. When Sn-37Pb or Sn-36Pb-2Ag solder ball without Cu core was used, metastable (Au, Ni) Sn<SUB>3</SUB> layer with high growth rate was formed on the bondline, which enhanced the formation of Pb layer in the solder. For Cu cored solder, equilibrium (Au, Cu, Ni) <SUB>6</SUB>Sn<SUB>5</SUB> reaction layer was formed and suppressed the Ni-Sn interaction. Because of the absence of Pb layer resulted from the slower growth rate of (Au, Cu, Ni) <SUB>6</SUB>Sn<SUB>5</SUB> reaction layer, Cu cored solder ball/pad joint was less degraded after high temperature storage.
- 社団法人 エレクトロニクス実装学会の論文