スポンサーリンク
社団法人 エレクトロニクス実装学会 | 論文
- タイトル無し
- Influence of Additives on Via-Filling Using Copper Electroplating.
- タイトル無し
- EMC of Semiconductor Packages. EMI Evaluation of Semiconductor Packages.
- Graphical Introduction of Interconnect and Packaging Technologies for Optoelectronic Devices 1. Packaging Technology in Lightwave Communication.
- Driver LSI Mounting Technology for LCD Panel.
- Photosensitive Polyimide Curable at Low Temperature and Its Application to Flexible Printed Circuits.
- Method for Evaluation of Bridge on Fine-Pitch Micro-Soldering.
- Feasibilities on Ultrasonic Flip-Chip Bonding in 20 .MU.m-pitch for COC Structure.
- Shape and Behavior ofa Molten Solder by VPS Reflow on Narrow Copper Terminals for QFP.
- タイトル無し
- タイトル無し
- Intention to Special Issue for Trend of BGA·CSP·KGD
- Effects of Using New Additive on Pd Plating for Pd-PPF Process
- Lead-Free Microsoldering Characteristics by Pulsed YAG-Laser Process.
- Influence of Various Factors on Lift-off Phenomenon in Wave Soldering with Sn-Bi Alloy.
- Development of High-Speed EMI Simulator for Electromagnetic Noise Emission from a Digital PCB.
- Electrodeposition of Tin-Zinc Eutectics Alloy and Codeposition Mechanism of Zinc for Low Temperature Lead-Free Soldering.
- Packaging Technologies of Optical Circuits. Trends of Optoelectronics Circuit Packaging Technology.
- Acid Copper Plating for Via Filling Using IrO2/Ti Insoluble Anode