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社団法人 エレクトロニクス実装学会 | 論文
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- Crystal Orientation and Growth of Electrolytic Copper Foil.
- Electrical Properties of Buried Capacitor in Zero X-Y Shrinkage Multilayer Ceramic Substrate.
- Bendable IMST substrate for high-density miniaturized hybrids.
- Report of the 42th SHM Electronics Packaging Seminar and a Factory Tour.
- Thic film materiales for copper hybrid circuits.
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- Necessity of the Immunity Test about the Printed Circuit Board.
- Vertical Integration of Optical Waveguides and Interconnection by a Pair of Integrated Grating Couplers.
- Multiwave Optical Interconnection
- Phase Growth Model and Application to Thermal Cyclic Loading in Sn/Pb Eutectic Solder Joints.
- Effect of Cu Cored Ball in Solder Ball on Microstructure and Strength of BGA Joint Using Electroless Plated Ni/Au Pad.
- Structure Analysis of Solder Ball Joint Interface on Electroless Ni-B with Immersion Au deposition
- An Interconnect Topology Optimization by Tree Transformation.
- Role of Copper Electrodeposition Additives for Via-Filling.
- Embedded Die Technology Breakthrough: The Redistributed Chip Package
- Application to Flip-Chip Mounting of RF IC by Using Micro Cu-Cored Solder Balls.
- Separable Wire Bonding and Application to the Interposer-Less CSP.
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- Effect of Pyridinium Propylsulfonate on Shape of Electrodeposited Nickel Micro-Bumps