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社団法人 エレクトロニクス実装学会 | 論文
- Application and Evaluations for Electroless Plated Bump Formation.
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- Tape Carrier with Buried Via-Holes of Copper Plating for BGA Package of Good Ball Solderability.
- Mount technology in the future.
- Special Articles: Recent Trends on MCM and Bare LSI Chip Mounting. Manufacturing Process of PWBs for the Substrate of MCM and Bare Chip Mounting. Full-Additive Process.
- The practical investigation of laser direct imaging (LDI) for application to printed wiring board fabrication.
- Development of the Fine Tool Processing for Fine Pitch Lead Frames and Its FEM Analysis.
- The latest trend in flexible printed wiring board.
- The Future Prospects of Optical Packaging Technologies.
- Properties of Electroplated Sn-Ag Alloy Films as Pb-Free Solderable Coating Obtained by Composite Plating.
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- Assistant Tool of Placement and Routing on CAD for Reducing Noise.
- Special Articles: Design for Printed Circuit Boards and Its Electromagnetic Characteristics. 2. Noise Reduction Techniques. Reduction of EMI from Printed Wiring Boards by Using Copper Paste.
- An Extraction Method of Regularity in Circuit Connections.
- Applied AC Voltage for Detecting Open Leads of CMOS LSI by Monitoring Supply Current under AC Electric Field
- Packaging Technology for Automotive Power Device.
- Trends of MCM Application. MCM Assembly. Flip Chip Bonding Technology.
- Adhesion between insulation layer and 42 alloy.
- Thermal Fatigue Life of Soldered Joints of Flat Package.
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