The practical investigation of laser direct imaging (LDI) for application to printed wiring board fabrication.

概要

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This paper reports the results of the practical investigation on Laser Direct Imaging, abbreviated as LDI here, in views of the application to printed wiring board fabrication. The studies are based on the operation of LDI apparatus newly developed, which utilizes 488 nm wavelength of Argon laser oscillation.<BR>Firstly, the measurements of the physical properties of a laser dryfilm photoresist such as optical, photosensitive, and thermal characteristics, have been made, and the test pattern panels have been processed through the processes from lamination to development including LDI, so that the fundamental compatibility of the dryfilm resist properties with LDI apparatus has been confirmed.<BR>Secondly, 4 layer boards are prototyped with LDI to evaluate the practicability of LDI application to PWB fabrication. Additionally, the raw cost of the panels with LDI has been estimated, and shown comparatively with the conventional phototool method. The economical advantage of LDI is commented on more positively as the production lot becomes more diversified and smaller in size, while the breakeven point of LDI with the phototool method being illustrated.
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