Application and Evaluations for Electroless Plated Bump Formation.
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概要
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We have studied and learned that there are many advantages with the micro bump formation using the electroless plating method. Also the study on the usefulness of the process has been reported. This time we have experimented bonding TAB tapes on to the electroless plated bumps formed LCD driver IC. The results from the visual appearance seen from SEM photos and the break mode of the pull tests conducted on the bonded area shows that proper ILB conditions were found.
- 社団法人 エレクトロニクス実装学会の論文