Adhesion between insulation layer and 42 alloy.
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概要
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The thermal expansion coefficient of 42 alloy base PWB (printed wiring board) is as low as those of ceramic chip carrier or silicon chip. So the reliability of PWB on which these devices are directly mounted is expected to be high. But, when epoxy resin was used as the insulation layer, the delamination of the epoxy resin layer from 42 alloy base or the crack in the epoxy resin layer occurred after 400-500 heat cycles of -50 °C/ 30min. and 150 °C/ 30min. The insulation layer composed of thermal spraying alumina ceramics and resin was found to show no delamination and crack even after 2000 heat cycles. The reason was speculated that the high elasticity and low thermal expansion property of the ceramic layer toughened the insulation layer, eliminating the concentration of the thermal stress.
- 社団法人 エレクトロニクス実装学会の論文