Phase Growth Model and Application to Thermal Cyclic Loading in Sn/Pb Eutectic Solder Joints.
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概要
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In this study, thermal fatigue damage of Sn/Pb solder joints has been evaluated in relation to microstructural phase growth. A phase growth model has been devised through the systematic microstructural observation using lap joint type shear specimen proposed by the authors. The phase growth is characterized by phase growth parameter S, which is defined as average phase size to the 4th power <I>d<SUP>4</SUP></I>. This model was applied to the phase growth process in actual thermal cyclic loading tests by using fabricated PCBs. Consequently, a simple power law relation exists between the average number of cycles to thermal fatigue crack initiation<I> N<SUB>1</SUB></I> and the average increase in strain-induced phase growth parameter per one cycle Δ<I>S<SUB>c</SUB></I>. The relation will enable us to evaluate the thermal fatigue crack initiation of actual solder joints through the microstructural observations.
- 社団法人 エレクトロニクス実装学会の論文