Separable Wire Bonding and Application to the Interposer-Less CSP.
スポンサーリンク
概要
- 論文の詳細を見る
For the purpose of applying the wire separation method to the LSI packaging, we studied the separability of the gold wires that were thermosonicaly bonded to the silver plating. The experimental results suggested the possibility of separable ball strain ranges for the bonding. Moreover, it was found that the yield of the gold wire separation was the highest when the wires are bonded at the perimeter of the contact surface. The smaller the ultrasonic power was, the more easily such a bonding status could be obtained. The prototype model of an inter-poser-less CSP by applying the separation method was prepared. In the packaging process, the wire-bonded substrate was mechanically separated to expose the tip of wires. By adopting this method, the separation process was simplified compared with the etching dissolution of the substrate.
- 社団法人 エレクトロニクス実装学会の論文