Influence of Various Factors on Lift-off Phenomenon in Wave Soldering with Sn-Bi Alloy.
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概要
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The mechanism of lift-off and the influence of various factors have been examined by using basic Sn- (2-5wt%) Bi alloys. The Sn-2wt%Bi alloy exhibits lift-off and the probability of occurrence increases with increasing Bi content. Lift-off occurs by the segregation of Bi, which diffuses a short distance, into the interfacial area between Sn-Bi alloys and a Cu land during formation of dendritic solidification. The occurrence of lift-off is also influenced by thickness of Cu leads in through-holes. Thicker wire makes severer lift-off. Lift-off is influenced by the height of solder fillet. Higher fillet makes severer lift-off and the up-side of printed boards, which has low fillets, seldom shows lift-off. Rapid cooling after soldering can stop lift-off effectively.
- 社団法人 エレクトロニクス実装学会の論文