Lead-Free Microsoldering Characteristics by Pulsed YAG-Laser Process.
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概要
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Fluxless solderability of Lead-free solder by pulsed YAG laser has been investigated by the tensile test on butt joint of plated pin specimens. The effects of laser irradiation condition, and composition and structure of plating on the tensile strength of joint were investigated. The joint quality depended on the laser irradiation power and time. Under the appropriate power, the tensile strength of pin specimen was increased with irradiation time. The increase of strength was corresponded to the progress of wetting. The non-wetted area was found in fluxless laser soldered specimen. Laser irradiation on the flux soldered butt specimen increased the joint strength, this effect is believed to be derived by the fine microstructure in laser irradiated specimen.
- 社団法人 エレクトロニクス実装学会の論文