Evaluation of Mechanical Properties of Pb Free Solder Alloys.
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概要
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The most promising candidate for Pb free solder would be the Sn-Ag alloys containing Bi or In to lower their melting points. In this paper, the mechanical properties of Sn-Ag alloys containing Bi have been evaluated in comparison with those of Pb-Sn eutectic solder. Our experiments indicated that these alloys have higher tensile strength and lower breaking elongation than Pb-Sn eutectic solder. Especially at room temperature, the coefficient expressing their sensitivity to strain rates was found to be lower than that of Pb-Sn eutectic solder. The breaking elongation of these alloys does not depend on strain rates. Therefore, it is predicted that the creep characteristics of these alloys are superior to those of Pb-Sn eutectic solder.
- 社団法人 エレクトロニクス実装学会の論文