Bonding Process for Nanoscale Wiring Using Carbon Nanotube by STM Tip
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概要
- 論文の詳細を見る
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2003-04-30
著者
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Aoki Nobuyuki
Department Of Electronics And Mechanical Engineering Chiba University
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Ishibashi K
Semiconductor Laboratory Riken
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OCHIAI Yuichi
Department of Materials Technology, Chiba University
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ISHIBASHI Koji
Semiconductors Laboratory, The Institute of Physical and Chemical Research (RIKEN)
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IDA Tetsuya
Semiconductors Laboratory, The Institute of Physical and Chemical Research (RIKEN)
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YAMADA Syoji
School of Materials Science, Japan Advanced Institute of Science and Technology-Hokuriku
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Kida Michio
Department Of Materials Technology & Center For Frontier Electronics And Photonics Chiba Univers
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TAKAYAMA Junpei
Department of Materials Technology & Center for Frontier Electronics and Photonics, Chiba University
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HORIUCHI Kazunaga
Corporate Research Center, Fuji-Xerox Co., Ltd.
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