Low-Temperature Bonding of Silver to Aluminum

概要

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Direct bonding of silver to aluminum was achieved using silver-oxide particles with silver acetate (CH3COOAg) as a bonding material. When silver acetate was used, it reduced the silver oxide, and the resulting silver powder was sintered at 190 °C. In contrast, when silver oxide alone was used, the reduction and sintering required a temperature of 400 °C. The shear strength of the bonds formed with the silver-oxide/silver-acetate joining medium increased with increasing bonding temperature; for example, 2.5 min holding at 400 °C in air under a bonding pressure of 2.5 MPa yielded an average shear strength of 9 MPa. As confirmed by cross-sectional transmission electron microscopy equipped with electron-energy-loss spectroscopy (TEM-EELS), the bonding of sintered silver to aluminum was achieved through an aluminum-oxide layer formed on the aluminum. This bonding of sintered silver to aluminum oxide at a temperature of 400 °C or less is thought to be due to the large amount of heat (680 J/g) generated by the combustion of CH3 radicals in silver acetate during sintering.
2012-02-25