Ultra-Conformal Metal Coating on High-Aspect-Ratio Three-Dimensional Structures Using Supercritical Fluid: Controlled Selectivity/Non-Selectivity
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概要
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Underlayer dependence can be controlled for supercritical fluid deposition (SCFD) of Cu. SCFD, which has a remarkable potential for ultra-conformal deposition and gap-filling, has previously required a metallic underlayer to initiate deposition. Here, this constraint has been overcome by depositing a novel catalytic layer, CuMnxOy, onto a semiconducting and insulating substrate. The stoichiometry of CuMnxOy affected both the morphology of CuMnxOy film and the catalytic effect on succeeding SCFD of Cu. By using this technique of depositing CuMnxOy as a catalytic layer, conformal SCFD of Cu was achieved on high-aspect-ratio trenches (aspect ratio 50) whose surfaces were SiO2. In conclusion, a CuMnxOy film with graded stoichiometry in the depth direction might improve the adhesion between Cu and an insulative underlayer.
- 2012-05-25
著者
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Sugiyama Masakazu
Institute Of Engineering Innovation School Of Engineering The University Of Tokyo
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Momose Takeshi
Institute of Industrial Science, The University of Tokyo, Meguro, Tokyo 153-8505, Japan
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Yamada Hideo
3D Bio Electromechanical Autonomous Nano Systems (BEANS) Center, BEANS Project, Meguro, Tokyo 153-8505, Japan
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Sugiyama Masakazu
Institute of Industrial Science, The University of Tokyo, Meguro, Tokyo 153-8505, Japan
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Uejima Takeshi
Department of Materials Engineering, The University of Tokyo, Bunkyo, Tokyo 113-8656, Japan
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Shimogaki Yukihiro
Institute of Industrial Science, The University of Tokyo, Meguro, Tokyo 153-8505, Japan
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