Three-Dimensional Binocular Range Sensor Large Scale Integration with a 410 μs/Frame Output Time High-Speed Data Output Method
スポンサーリンク
概要
- 論文の詳細を見る
We developed a three-dimensional (3D) binocular range sensor LSI equipped with a high-speed data output circuit. The circuit outputs only the information of the position corresponding to the detected object. As a result, the output time was reduced and the frame rate improved. The chip was produced using a process of 0.35 μm complementary metal oxide semiconductor (CMOS) 1-poly 3-metal and has a die size of $4.20\times 3.33$ mm2. The chip uses a 3.0 V supply voltage and has a power consumption of 405 mW at a clock frequency of 10 MHz. The correlation of the image sensor’s output takes 32 μs/frame and the maximum output time is 410 μs/frame. Because the output time is shorter enough than typical exposure, the frame rate is practically not limited by the data output time.
- 2010-04-25
著者
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Arima Yutaka
Center For Microelectronic System Kyushu Institute Of Technology
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Norihito Kawaguchi
Center for Microelectronic System, Kyushu Institute of Technology, 680-4 Kawazu, Iizuka, Fukuoka 820-8502, Japan
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Kawano Masatomo
Fukuoka Industy, Science and Technology Foundation, Iizuka, Fukuoka 820-8502, Japan
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Kawaguchi Norihito
Center for Microelectronic System, Kyushu Institute of Technology, Iizuka, Fukuoka 820-8502, Japan
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Yutaka Arima
Center for Microelectronic System, Kyushu Institute of Technology, 680-4 Kawazu, Iizuka, Fukuoka 820-8502, Japan
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Masatomo Kawano
Fukuoka Industry, Science and Technology Foundation, 680-4 Kawazu, Iizuka, Fukuoka 820-8502, Japan
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