Three-Dimensional Binocular Range Sensor LSI with Enhanced Correlation Signal

概要

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We developed a three-dimensional (3D) binocular range sensor LSI with an enhanced correlation signal. The developed LSI chip was produced using a process of 0.35 μm complementary metal oxide semiconductor (CMOS) 1-poly 3-metal and has a die size of $4.20\times 3.33$ mm2. The chip uses a 3.0 V supply voltage and has a power consumption of 280 mW at a clock frequency of 10 MHz. Two image sensors and the circuits for binocular stereo vision are integrated into the sensor. The distance to an object is determined by calculating the correlation between the two photosensors’ output differential signals and observing the position of strong correlated values. However, in the previously developed range sensor, the correlation was weak when there was a small differential signal and it was unable to simultaneously detect several objects. In the newly developed range sensor, a circuit that modulates the differential signal was integrated and the correlation process was enhanced. The object detection signals are ten times larger than those of the previous sensor. As a result, we were able to simultaneously detect the 3D position of several objects. All the necessary calculations for 3D detection take 32 μs per frame. However, the output time for one 3D frame is 26 ms. Thus, the frame rate is limited to 38 frames per second.
2010-04-25