Study of Bonding Technology Using Silver Nanoparticles
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概要
- 論文の詳細を見る
We investigated a new bonding technique utilizing nano-scaled particles for use in high-temperature environments. The results of our investigations revealed that the method could be used to form bonds by simultaneously applying heat and pressure. Moreover, compared to a conventional Pb–5Sn-solder bond, a nanoparticle-based bond suffered no degradation in bonding strength over an elevated-temperature holding period of 1000 h at 250 °C, and its discharge characteristics were improved (i.e., increased) threefold. It is possible to extend this bonding technique to mounting components in devices that operate in high-temperature environments, e.g., it can be used to mount components such as silicon carbide (SiC) devices, which are expected to be applied in environments with temperatures exceeding 250 °C.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2008-08-25
著者
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Yasuda Yusuke
Materials Research Laboratory Hitachi Ltd.
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Ide Eiichi
Materials Research Laboratory Hitachi Ltd.
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Hirose Akio
Division Of Materials And Manufacturing Science Graduate School Of Engineering Osaka University
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Morita Toshiaki
Materials Research Laboratory Hitachi Ltd.
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Kobayashi Kojiro
Division of Materials and Manufacturing Science, Osaka University, Suita, Osaka 565-0871, Japan
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Hirose Akio
Division of Materials and Manufacturing Science, Osaka University, Suita, Osaka 565-0871, Japan
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Morita Toshiaki
Materials Research Laboratory, Hitachi Ltd., Hitachi, Ibaraki 319-1292, Japan
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